Products

Dual sockets P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processorsCPU TDP supports Up to 270W TDP3 UPI up to 11.2 GT/s Intel® C621A Chips...

Key Features Dual sockets P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processorsCPU TDP supports Up to 270W TDP3 UPI up to 11.2 GT/s Intel...

Key Features Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake) 16 DIMMs; up to 4TB 3DS ECC DDR4-293...

Key Features Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake) 16 DIMMs; up to 4TB 3DS ECC DDR4-293...

2U GPU server powered by dual-socket 3rd Gen Intel Xeon Scalable processors that supports up to 16 DIMM, four dual-slot GPU, 4 M.2, eight NVMe (by ...

AMD EPYC 7003&7002 2U single-socket GPU server supports up to 8 single-slot GPUs, 8 DIMM, PCIe 4.0, M.2, NVMe, OCP 3.0, Dual LAN, and max. TDP ...

KEY FEATURES Powered by AMD EPYC 7003 processor with 64 cores, 128 threads and support for a maximum TDP of up to 280 watts per socket GPU...

KEY FEATURES Up to eleven PCIe® 4.0 slots enables higher bandwidth and improved data transfer rates GPU-optimized design allows four doubl...

Key Features Single Socket Ampere Altra Processor (Up to 80 Cores; Up to 3.3Ghz) / Single Socket Ampere Altra Max Processor (Up to 128 Cores; ...

Key Features Design with compliance to NEBS-Level 3 Single Socket P+ (LGA-4189) 3rd Generation Intel® Xeon® Scalable Processors 8 DIMM...

Key Features Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/...

Intel Xeon LGA 3647 2U single-socket storage server supports up to 12x 3.5" convertible drive bays, 8 DIMM, 7 PCI-E slots, SAS 3.0/SATA 3.0/NVMe ho...

Key Features Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/I...

Key Features Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processor (per node) Intel® C621A Chipset 8 DIMMs; Up to 2TB 3D...

Key Features Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processor (per node) Intel® C621A Chipset 8 DIMMs; Up to 2TB 3D...

Key Applications    - Cyber Security  - Cloud Service - Dedicated Hosting  - Cloud Service - Dynamic Front End Web  - Visual & Audio - Media De...

KEY FEATURES NVIDIA® HGA A100 with four Tensor Core GPUs delivers 80 teraFLOPS of FP64 for HPC workloads Fueled by a single AMD EPYC 7003 ...

Key Features Flexible GPU support: active & passive GPUsUp to 8 direct attached double width, full length GPUs Dual-Socket, AMD EPYC™ ...

Key Features Flexible GPU support: active & passive GPUsSingle Root Configuration with PCI-E Switch for up to 10 double width, full length...

Key Features Dual Root Configuration with PCI-E Switch for up to 10 double width, full length GPUsFlexible GPU support: active & passive G...

Key Applications - High Performance Computing- Rendering- VDI- AI/Deep Learning Training Key Features Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeo...

Key Applications - High Performance Computing- AI/Deep Learning Training- Cloud Gaming- Molecular Dynamics Simulation Key Features 1. Supports up ...

Key Features Supports 3rd Gen Intel® Xeon® Scalable or Xeon® W-3300 Processors with TDP up to 270W 7 PCI-E 4.0 Slots 1x 10GBase-T, 1x 1GbE, and de...